Heat dissipating apparatus and manufacturing method thereof

ABSTRACT

A heat dissipating apparatus includes a carrier layer, a basal capillary layer and a capillary post. The carrier layer has a heat exchange surface and a carrier surface. The carrier surface faces away from the heat exchange surface. The basal capillary layer has a first surface and a second surface opposite to each other. The basal capillary layer is stacked on the carrier layer so that the first surface of the basal capillary layer contacts the carrier surface of the carrier layer. The capillary post protrudes from the second surface of the basal capillary layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 202210586928.7 filed in China, on May 26, 2022, the entire contents of which are hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to a heat dissipating apparatus and a manufacturing method thereof, more particularly to a heat dissipating apparatus having a composite capillary structure and a manufacturing method thereof.

BACKGROUND

A vapor chamber and a heat pipe are similar in the heat dissipation principle, but they are different in the conduction manner. The heat pipe only transfers heat in one dimension, while the vapor chamber transfers heat in two dimensions. Therefore, the heat dissipation of the vapor chamber is more effective. Specifically, the vapor chamber mainly includes a chamber and a capillary structure. The chamber has an interior space for accommodating working fluid. The capillary structure is disposed in the interior space. The chamber has an evaporation area for heat absorption and a condensation area for heat dissipation. The working fluid absorbs heat and is vaporized in the evaporation area to rapidly spread to the whole interior space. The vaporized working fluid dissipates heat and is condensed into liquid form in the condensation area and then returns to the evaporation area via the capillary structure so as to form a cooling circulation.

However, with the trend of light, thin, short and small electronic products, the inner space in the electronic product is limited, and the conventional capillary structure of the vapor chamber installed therein is difficult to meet the required fluid circulation efficiency and heat conduction efficiency.

SUMMARY

The present disclosure provides a heat dissipating apparatus and a manufacturing method thereof capable of providing sufficient fluid circulation efficiency and heat conduction efficiency to catch the trend of light, thin, short and small electronic products where the heat dissipating apparatus is installed.

One embodiment of the present disclosure provides a heat dissipating apparatus including a carrier layer, a basal capillary layer and a capillary post. The carrier layer has a heat exchange surface and a carrier surface. The carrier surface faces away from the heat exchange surface. The basal capillary layer has a first surface and a second surface opposite to each other. The basal capillary layer is stacked on the carrier layer so that the first surface of the basal capillary layer contacts the carrier surface of the carrier layer. The capillary post protrudes from the second surface of the basal capillary layer.

Another embodiment of the present disclosure provides a manufacturing method of a heat dissipating apparatus including sintering a basal capillary layer on a carrier layer, and extruding a metal powder to form at least one capillary post on the basal capillary layer.

Another embodiment of the present disclosure provides a heat dissipating apparatus including a casing and a composite capillary structure. The casing includes a first heat conduction case and a second heat conduction case. The second heat conduction case is coupled to the first heat conduction case so that the second heat conduction case and the first heat conduction case together form a chamber. The composite capillary structure is located in the chamber. The composite capillary structure includes two basal capillary layers and a plurality of capillary posts. Each of the two basal capillary layers has a first surface and a second surface opposite to each other. The first surfaces of the two basal capillary layers are respectively connected to the first heat conduction case and the second heat conduction case. The plurality of capillary posts has two opposite ends respectively connected to the second surfaces of the two basal capillary layers.

According to the heat dissipating apparatus and the manufacturing method thereof as described above, the capillary post and the basal capillary layer can form a composite capillary structure, which is able to improve the fluid circulation efficiency and the heat conduction efficiency of the heat dissipating apparatus.

Moreover, a plurality of capillary posts can be provided on the basal capillary layer in one process, thereby simplifying the overall manufacturing process.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only and thus are not limitative of the present disclosure and wherein:

FIG. 1 is a perspective view of a heat dissipating apparatus in accordance with the first embodiment of the present disclosure;

FIG. 2 to FIG. 4 are schematic views for showing manufacturing processes of the heat dissipating apparatus in FIG. 1 ;

FIG. 5 is a cross-sectional view of a heat dissipating apparatus in accordance with the second embodiment of the present disclosure; and

FIG. 6 is a partial and perspective view of a first heat conduction case, a basal capillary layer and a capillary post of the heat dissipating apparatus in FIG. 5 .

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

In addition, the terms used in the present disclosure, such as technical and scientific terms, have its own meanings and can be comprehended by those skilled in the art, unless the terms are additionally defined in the present disclosure. That is, the terms used in the following paragraphs should be read on the meaning commonly used in the related fields and will not be overly explained, unless the terms have a specific meaning in the present disclosure.

Please refer to FIG. 1 , which is a perspective view of a heat dissipating apparatus in accordance with the first embodiment of the present disclosure.

In this embodiment, the heat dissipating apparatus 10 includes a carrier layer 100, a basal capillary layer 200 and a capillary post 300. The carrier layer 100 is, for example, a metal sheet such as a silver sheet, a copper sheet, and an aluminum sheet. The carrier layer 100 has a heat exchange surface 110 and a carrier surface 120. The heat exchange surface 110 is configured to thermally contact or to be thermally coupled to a heat source (not shown) or a water cooling radiator. That is, the heat exchange surface 110 is, for example, a heat exchange surface or a condensation surface. The carrier surface 120 faces away from the heat exchange surface 110. The basal capillary layer 200 is, for example, a mesh capillary layer, e.g., a metal mesh such as a silver mesh, a copper mesh, or an aluminum mesh, or a powdery capillary layer, such as a powdery capillary layer stamped from metal powder. Its metal mesh is a lattice-form capillary. The basal capillary layer 200 has a first surface 210 and a second surface 220 opposite to each other. The basal capillary layer 200 is stacked on the carrier layer 100 so that the first surface 210 of the basal capillary layer 200 contacts the carrier surface 120 of the carrier layer 100. The capillary post 300 is, for example, a metal powder post such as a silver powder post, a copper powder post, or an aluminum powder post stamped from metal powder. The metal powder is, for example, a powder particle having a mesh number greater than or equal to 500 and a diameter greater than or equal to 25 micrometers (μm). The capillary post 300 protrudes from the second surface 220 of the basal capillary layer 200. The capillary post 300 and the basal capillary layer 200 are in fluid communication through the capillary action of their capillary structure, and the fluid circulation efficiency and the heat conduction efficiency of the heat dissipation apparatus 10 can be improved.

In this embodiment, the capillary post 300 is stamped on the basal capillary layer 200. Since the basal capillary layer 200 are porous and rough in its surface, when the capillary post 300 is stamped on the porous and rough surface, the engagement between the capillary post 300 and the basal capillary layer 200 can be secured. That is, the capillary post 300 stamped on the rough surface of the basal capillary layer 200 can enhance the coupling between the capillary post 300 and the basal capillary layer 200.

In this embodiment, the quantity of the capillary post 300 is one, but the present disclosure is not limited thereto. In some other embodiments, the quantity of the capillary post 300 may be plural, and for example, they are arranged in an array or in a straight line.

In this embodiment, a mesh number of the basal capillary layer 200 is, for example but not limited to, greater than or equal to 60 and less than or equal to 500, so as to not only ensure the coupling between the carrier layer 100, the basal capillary layer 200 and the capillary post 300 but also improve the heat conduction effect of the heat dissipating apparatus 10.

In this embodiment, a diameter of the capillary post 300 is, for example but not limited to, greater than or equal to 0.5 millimeters (mm) and less than or equal to 30 mm, so as to not only ensure the coupling between the carrier layer 100, the basal capillary layer 200 and the capillary post 300 but also improve the heat conduction effect of the heat dissipating apparatus 10.

In this embodiment, a porosity of the capillary post 300 is, for example but not limited to, greater than or equal to 0% and less than or equal to 50%, so as to not only ensure the coupling between the carrier layer 100, the basal capillary layer 200 and the capillary post 300 but also improve the heat conduction effect of the heat dissipating apparatus 10.

Please refer to FIG. 2 to FIG. 4 , which are schematic views for showing manufacturing processes of the heat dissipating apparatus in FIG. 1 . First, as shown in FIG. 2 , the basal capillary layer 200 is sintered on the carrier layer 100. Then, as shown in FIG. 3 , the basal capillary layer 200 and the carrier layer 100 are placed on a lower mold 51, and metal powder is poured into a hole of an upper mold 52 so that a lower surface 310 of the metal powder 300A contacts the basal capillary layer 200. Then, as shown in FIG. 4 , the metal powder 300A located in the hole of the upper mold 52 is pressed by a punch 53 via an upper surface 320A of the metal powder 300A to form a capillary post 300 on the basal capillary layer 200, and an upper surface 320 of the capillary post 300 is configured to be connected to another casing or capillary structure (not shown in the drawings referring to the present embodiment).

Please refer to FIG. 5 and FIG. 6 , where FIG. 5 is a cross-sectional view of a heat dissipating apparatus in accordance with the second embodiment of the present disclosure, and FIG. 6 is a partial and perspective view of a first heat conduction case, a basal capillary layer and a capillary post of the heat dissipating apparatus in FIG. 5 . In this embodiment, the heat dissipating apparatus 1 is, for example, a vapor chamber, including a casing 2 and a composite capillary structure 3. The casing 2 includes a first heat conduction case 21 and a second heat conduction case 22. The casing 2 may further include an adhesive 23. The first heat conduction case 21 is coupled to the second heat conduction case 22 via the adhesive 23 so that the first heat conduction case 21 and the second heat conduction case 22 together form a chamber S therebetween. The materials of the first heat conduction case 21 and the second heat conduction case 22 are, for example, metals such as gold, silver, copper, and aluminum. The adhesive 23 is, for example, copper paste. The composite capillary structure 3 is located in the chamber S, including two basal capillary layers 200 and a plurality of capillary posts 300. Each of the two basal capillary layers 200 has a first surface 210 and a second surface 220 opposite to each other. The first surfaces 210 of the two basal capillary layers 200 are respectively connected to the first heat conduction case 21 and the second heat conduction case 22. Two opposite ends of the plurality of capillary posts 300 respectively connected to the second surfaces 220 of the two basal capillary layers 200.

In this embodiment, the first heat conduction case 21 is coupled to the second heat conduction case 22 via the adhesive 23, but the present disclosure is not limited thereto. In some other embodiments, the heat dissipating apparatus may not include any adhesive, and the first heat conduction case may be coupled to the second heat conduction case by, for example, pressing.

In this embodiment, the plurality of capillary posts 300 of the composite capillary structure 3 are stacked on the basal capillary layers 200 of the first heat conduction case 21. That is, the first heat conduction case 21 can be regarded as the carrier layer 100 in the embodiment referring to FIG. 1 . However, stacking the capillary posts 300 on the basal capillary layers 200 of the first heat conduction case 21 is not intended to restrict the present disclosure. In some other embodiments, the plurality of capillary posts of the composite capillary structure may be alternatively stacked on the basal capillary layers of the second heat conduction case. That is, the second heat conduction case can be regarded as the carrier layer 100 in the embodiment referring to FIG. 1 .

The capillary posts 300 are formed by stamping, and abut on and located between the two basal capillary layers 200 for providing a support function. Moreover, the first heat conduction case 21 and the second heat conduction case 22 of the two basal capillary layers 200 can be in fluid communication with each other via the capillary posts 300, such that the overall heat conduction efficiency and fluid circulation efficiency can be improved. Further, the capillary posts 300 can be provided on the basal capillary layer 200 in one process, comparing to the conventional manufacturing process which needs to place and weld the capillary posts individually, the manufacturing process of the composite capillary structure 3 in this embodiment is simple, thereby improving manufacturing efficiency and reducing cost. Also, the capillary posts 300 can be stamped on the basal capillary layer 200 at room temperature at the same time by utilizing the plasticity of copper powder. Therefore, a heating process can be eliminated during the stamping process.

According to the heat dissipating apparatus and the manufacturing method thereof as described above, the capillary post and the basal capillary layer can form a composite capillary structure, which is able to improve the fluid circulation efficiency and the heat conduction efficiency of the heat dissipating apparatus.

Moreover, a plurality of capillary posts can be provided on the basal capillary layer in one process, thereby simplifying the overall manufacturing process.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure. It is intended that the specification and examples be considered as exemplary embodiments only, with a scope of the disclosure being indicated by the following claims and their equivalents. 

What is claimed is:
 1. A heat dissipating apparatus, comprising: a carrier layer, having a heat exchange surface and a carrier surface, wherein the carrier surface faces away from the heat exchange surface; a basal capillary layer, having a first surface and a second surface opposite to each other, wherein the basal capillary layer is stacked on the carrier layer so that the first surface of the basal capillary layer contacts the carrier surface of the carrier layer; and a capillary post, protruding from the second surface of the basal capillary layer.
 2. The heat dissipating apparatus according to claim 1, wherein the carrier layer is a metal sheet.
 3. The heat dissipating apparatus according to claim 1, wherein the basal capillary layer is a metal mesh.
 4. The heat dissipating apparatus according to claim 3, wherein the basal capillary layer is a copper mesh.
 5. The heat dissipating apparatus according to claim 1, wherein the basal capillary layer is a metal powder post.
 6. The heat dissipating apparatus according to claim 1, wherein the capillary post is a metal powder post.
 7. The heat dissipating apparatus according to claim 1, wherein a mesh number of the basal capillary layer is greater than or equal to 60 and less than or equal to
 500. 8. The heat dissipating apparatus according to claim 1, wherein a diameter of the capillary post is greater than or equal to 0.5 millimeters and less than or equal to 30 millimeters.
 9. The heat dissipating apparatus according to claim 1, wherein a porosity of the capillary post is greater than or equal to 0% and less than or equal to 50%.
 10. A manufacturing method of a heat dissipating apparatus, comprising: sintering a basal capillary layer on a carrier layer; and extruding a metal powder to form at least one capillary post on the basal capillary layer.
 11. The manufacturing method of the heat dissipating apparatus according to claim 10, wherein the basal capillary layer is a metal mesh.
 12. The manufacturing method of the heat dissipating apparatus according to claim 11, wherein the basal capillary layer is a copper mesh.
 13. The manufacturing method of the heat dissipating apparatus according to claim 10, wherein a mesh number of the basal capillary layer is greater than or equal to 60 and less than or equal to
 500. 14. The manufacturing method of the heat dissipating apparatus according to claim 10, wherein a diameter of the capillary post is greater than or equal to 0.5 millimeters and less than or equal to 30 millimeters.
 15. The manufacturing method of the heat dissipating apparatus according to claim 10, wherein a porosity of the capillary post is greater than or equal to 0% and less than or equal to 50%.
 16. The manufacturing method of the heat dissipating apparatus according to claim 10, wherein the metal powder is a powder particle having a mesh number greater than or equal to 500 and a diameter greater than or equal to 25 micrometers.
 17. A heat dissipating apparatus, comprising: a casing, comprising a first heat conduction case and a second heat conduction case, wherein the second heat conduction case is coupled to the first heat conduction case so that the second heat conduction case and the first heat conduction case together form a chamber; and a composite capillary structure, located in the chamber, comprising: two basal capillary layers, each having a first surface and a second surface opposite to each other, wherein the first surfaces of the two basal capillary layers are respectively connected to the first heat conduction case and the second heat conduction case; and a plurality of capillary posts, having two opposite ends respectively connected to the second surfaces of the two basal capillary layers.
 18. The heat dissipating apparatus according to claim 17, wherein each of the basal capillary layer is a metal mesh.
 19. The heat dissipating apparatus according to claim 17, wherein each of the basal capillary layer is a metal powder post.
 20. The heat dissipating apparatus according to claim 17, wherein each of the capillary post is a metal powder post.
 21. The heat dissipating apparatus according to claim 17, wherein a mesh number of each the basal capillary layer is greater than or equal to 60 and less than or equal to
 500. 22. The heat dissipating apparatus according to claim 17, wherein a diameter of each the capillary post is greater than or equal to 0.5 millimeters and less than or equal to 30 millimeters.
 23. The heat dissipating apparatus according to claim 17, wherein a porosity of each the capillary post is greater than or equal to 0% and less than or equal to 50%. 